UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates

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Product Details
Customization: Available
After-sales Service: Overseas Technical Support
Warranty: 12 Months
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  • UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
  • UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
  • UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
  • UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
  • UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
  • UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
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  • Company Profile
  • Packaging & Shipping
  • After Sales Service
Overview

Basic Info.

Model NO.
CW-6050FZ/PZ/Z
Application
Aerospace Industry, Automotive Industry, Ceramic, Semiconductor, Rigid PCB
Cooling System
Water Cooling
Technical Class
Nanosecond UV Pulse Laser
Applicable Material
Nonmetal
Structure Type
Gantry Type
Laser Classification
Solid Laser
Laser Technology
UV Cold Laser Cutting
Laser Type
Ultrafast Laser
Laser Power
10W/30W/35W
Working Area
500*610mm
Positioning Accuracy
±1um
Processing Speed
≤3000mm/S
Processing Accuracy
≤30um
Focus Spot
≤20um
Scan Range of Galavanometer
50*50um
Positioning System
CCD Visual Auto Alignment
Motion System
Linear Motor X/Y Axis
Certification
CE
Processing Thickness
3mm
Processing Material
Rigid PCB, Alumina Ceramic, Semiconductor Substrat
Power Supply
AC 380V+10%, 50~60Hz
Laser Wavelength
355nm
Transport Package
Wooden Case
Specification
2200*1500*1750mm
Trademark
CHANXAN
Origin
Suzhou
Production Capacity
100sets/Month

Product Description

UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
Nanosecond Laser Cutting Machine(UV/IR/Green Light)
Chanxan provides Nanosecond laser cutting machines, with their core advantages of high precision, high stability, and wide material adaptability, are specifically designed for industries such as electronics, semiconductors, and new energy, which have stringent requirements for processing quality. They are particularly suitable for efficient and precise cutting of brittle and thin materials.
Equipment Advantages
Application Fields
1. High processing efficiency and operation stability.
2. Mature processing technique suitable for different types of images.
3. Precise laser energy control, leaving minimal HAZ(Heat Affected Zone).
4. Optional automation system to boost efficiency and cost-effectiveness. 
Applied in fields such as mobile, communications, semiconductors, new energy, etc. For instance, precision cutting, drilling, and etching of FPC, PCB, camera modules, ceramics, tungsten steel, PI and other polymer materials, as well as foil.
Key Configurations
1.Features a marble platform X/Y system driven by linear motors, ensuring precision and stability during high-speed operation with no long-term wear and low maintenance costs.
2.Configured with a high-pixel CCD automatic alignment function to guarantee precise product cutting alignment, enabling the processing of micro-sized cuts and complex irregular patterns.
3.Optional extra-large field telecentric lens supports a maximum single processing area of 200×200mm, allowing large-area processing without the need for stitching.
Technical Specifications
With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the strictest tolerances of 3C electronics, semiconductor, and aerospace industries.
Laser power
10W/30W/35W
Dimensions
2200*1500*1750mm
Working area
500*610mm
Certification
CE
Positioning Accuracy
±1um
Machinery Test Report
Provided
processing speed
≤3000mm/s
Video outgoing-inspection
Provided
processing accuracy
≤30um
Warranty of core components
12 Months
Focus Spot
≤20um
Applicable Industries
Rigid PCB, Alumina Ceramic, Semiconductor Substrat
Scan range of galavanometer
50*50um
Core Components
Semiconductor Pump Source
Company Profile
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
CHANXAN (CHANGSHU) LASER TECHNOLOGY Co., Ltd.
1.CHANXAN FOUNDED IN 2012
2.National high-tech enterprise, owning 150 national patents, and participating in the formulation of        industry standards.
3.Gazelle Enterprise, Technology-based Enterprise, Innovation-Based Enterprise, Suzhou Talent Enterprise, Purple Mountain Talent Enterprise, and partner of Fortune Global 500 Enterprises.
4.80,000 square meters of production factories; five major R&D, production, and sales bases in Changshu, Suzhou, Nanjing, Guangdong, and Vietnam.
5.Supplier of laser engraving equipment for the 2022 Winter Olympics torch; ****** Super Factory in 2021; recommended by Suzhou municipal government.
6.More than 100 offices and agents domestic and abroad, including factories and service centers in both South and North Vietnam.
7.Products have good sales in more than 100 countries, providing high-quality equipment and efficient services to countless industrial customers from all over the world.
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
Invention Patent
As a leader in the laser technology field, Chanxan has acquired 150 national patents and successfully established two independent brands. The company has not only established a strict enterprise product quality standard system with comprehensive filing to the quality supervision department, but has also deeply participated in the formulation of multiple industry standards as an industry pioneer. To strengthen its R&D and service capabilities, the company has invested in building a process R&D center equipped with dozens of advanced laser processing systems, which can provide not only comprehensive laser processing value-added services to customers,  but also solid hardware support for continuous innovation. Adhering to the mission of "Make sure every customer to use laser machines well", Chanxan is continuously promoting the industrial application and innovation of laser technology.
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
Advantages of Cooperating with CHANXAN Laser
Stable & High-Precision Equipment:With advanced ultraviolet, picosecond and other laser technologies, our machines deliver high processing accuracy, stable performance and long service life, helping customers improve product quality.
Cost-Effective & Efficient Production:Our laser equipment features low energy consumption, low maintenance cost and high processing speed, effectively shortening production cycles and reducing overall operating costs.
Comprehensive After-Sales Service:We offer on-site installation, commissioning, operator training and timely technical support, minimizing downtime and ensuring smooth production.
Strong R&D & Technical Support:Backed by a professional R&D team, CHANXAN Laser continuously upgrades technology and functions, helping customers stay competitive in the market.
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
Our Exhibition
‌Industry Communication & Technology Exchange‌
Showcase the company's cutting-edge laser equipment, such as the UV picosecond laser cutting machine, to enhance brand visibility and reputation both domestically and internationally. Target potential clients from emerging markets and expand the global customer base.
Engage in in-depth exchanges with peers, industry experts, and research institutions to keep abreast of the latest trends in laser processing technology, market demands, and regulatory policies. Explore opportunities for technical cooperation and joint research to drive innovation.
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
Chanxan Team Building Week
Chanxan Team Building Week
Chanxan is committed to creating a healthy, safe, and harmonious working environment for its employees, while also practicing the concept of green development and actively fulfilling its social responsibilities.
Employee Well-Being Improvement: Optimize living conditions and steadily increase income levels; strengthen skills training to support employee career development.
Packaging & Shipping
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
UV Nanosecond Laser Cutting Machine for PCB Ceramic Semiconductor Substrates
After Sales Service
1.We provide comprehensive technical support, including remote video guidance and professional telephone consultation, along with e-commerce value-added services, to provide our customers with a more convenient experience.
2.We promise a long-term and stable supply of genuine parts and high-quality consumables to ensure that the equipment is always in optimal operating condition.
Q1: What we can do for you?
A: We are committed to providing you with advanced equipment, technical solutions, and comprehensive service support to help you improve production efficiency, reduce costs, and optimize product quality.
Q2: Are you a trade company or manufacturer?
A: We are a manufacturer with independent research and development capabilities and manufacturing capabilities.
Q3: What is your delivery date?
A: About 35 days after receipt of payment.
Q4: Can we be your agent?
A:We warmly welcome global agents to cooperate with us. We will provide full support for agents to expand the market, including professional solutions for machine technical issues and comprehensive after-sales service. In addition, our agents can enjoy favorable discount policies and attractive commission returns.
Q5: What is the after-sales service?
A: We offer a one-year warranty and lifetime service for the products.During the warranty period, if the equipment malfunctions or components are damaged (excluding human factors and force majeure), the supplier will be responsible for free repair. The replacement parts required will be provided free of charge by the supplier (excluding consumables). After the warranty period, we will provide multiple support methods to ensure the normal operation of the system.

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